MusculoSkeletal Structure/Property Characterization Core

Scanning Acoustic Microscopy Laboratory

















Scanning Acoustic Microscopy Laboratory - uses non-destructive techniques to image the mechanical and internal microstructure of nontransparent mineralized tissues and biomaterials. Scanning acoustic microscopy (SAM) is a non-destructive technique that can be used to image the internal microstructure of nontransparent solids and surface mechanical properties. In acoustic microscopy, the focused acoustic wave is transmitted through the coupling liquid and interacts with specimens. The intensities of the collected signals are measured as mechanical properties such as density, elastic modulus under physiological conditions. There are two advantages in using SAM compared to optical or scanning electron microscopy: Non-destructive subsurface features detection lying in the ability of the acoustic waves to penetrate opaque materials. Non-destructive mechanical properties visualization and analysis. Scanning Acoustic Microscopy Laboratory features:

KSI 2000 High Frequency scanning acoustic microscope (HF SAM) (Kramer scientific instruments, Germany)

  • Working frequencies from 100 MHz to 2 GHz
  • Resolutions up to 0.4 µm, which is the highest available resolution for commercial scanning acoustic microscopes in the world

KSI WINSAM 100 Low Frequency scanning acoustic microscope (LF SAM) (Kramer scientific instruments, Germany)

  • Examine the surface, the inside or the back of larger specimen
  • 10, 30, 50 and 100 MHz acoustic lenses
  • Image with 512 x 512 pixels and 256 gray levels
  • Resolution 1280 x 1024
  • A-Scan (point echo histogram), B-Scan (section image), D-scan (diagonal section image
  • Scan speed up to 500 mm/s
  • Movement range up to 300mm in x and y direction
  • Integrated image processing functions
  • Autoscan function
  • Evaluation of the amplitude (gray values) from the echo signal using calibration materials. An impedance value is assigned to every grey value

    2000 MHz 3 µm 0.4 µm 46 µm
    1000 MHz 15 µm 1.1 µm 46 µm
    400 MHz /60 100 µm 3 µm 230 µm
    400 MHz/120 80 µm 2.5 µm 230 µm
    200 MHz /60 500 µm 7.5 µm 575 µm
    200 MHz/120 400 µm 5 µm 575 µm
    100 MHz 1000 µm 15 µm 2300 µm
    80 MHz   18 µm 6 - 9 mm
    50 MHz   30 µm 8 - 13 mm
    25 MHz   60 µm 15 mm
    20 MHz   75 µm 15 mm
    10 MHz   150 µm 15 mm
    (Approximate values. Kramer scientific instruments, Germany, 2001)

• Materials science and mechanical engineering, e.g. subsurface damage imaging, coating thickness measurement and delamination detection, material characterization, stress/strain analysis, etc.
• Semiconductor, e.g. IC packaging inspection, wafer evaluation, etc.
• Biomedicine, e.g. cells and tissues investigation, etc.